chip 3-terminal capacitor array design an d speci cations are each subject to change without notice. ask factory for the current technical speci cations befo re purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. i/o i/o i/o 3-terminal capacitors or emi filters (4 line mounting) i/o ezasc: 0.8 mm pitch ezanc: 1.27 mm pitch rf circuit digital control circuit (eza sc) prevent high frequency harmonic noise to rf circuits gnd gnd chip 3-terminal capacitor ar ray t ype: ezasc ezanc fea tures 1. suitable for emi suppression ? ltering the low residual inductance at high frequency range provides effective reduction of noise equivalent noise reduction to the emi ? lters with low cost design 2. compact design for high density pwb assembly ezasc : 4.0 mm 2.1 mm 0.65 mm, 0.8 mm pitch ezanc : 6.4 mm 3.1 mm 0.75 mm, 1.27 mm pitch flat and square packages suitable for high speed automatic placement machine 3. superior mountability with concave terminals firm solder joint (2 times that of convex terminal type) self-aligning placement during re? ow soldering digital cordless phone recommended applications digital equipment such as pcs, printers, hdd, pcmcia cards, pdas, and word processors communication equipment, digital cordless phones, automobile phones, gsm, phs, dect digital audio and video equipment electronic musical instruments, and other digital devices feb. 2006
chip 3-terminal capacitor array design an d speci cations are each subject to change without notice. ask factory for the current technical speci cations befo re purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. ezasc ezanc capacitance value suffix for special requirement capacitance tolerance 1 7 0 8 1 9 m 10 11 e 1 product code temperature characteristics z 2 a 3 n 4 c 5 e 6 thick film noise suppression and filtering components +20 %/?5 % (?5 cto+85 c) e the first two digits are significant figures of capacitance value, and the third one denotes the number of zeros following ex. 101 100 pf 20 % ?0 % m dimensions and circuit configuration nc 3.1 mm sc 2.1 mm four 3-terminal capacitors 6.4 mm 4.0 mm +30 % when less than 22 pf electrode (outer) protective coating alumina substrate gnd electrode (outer) gnd electrode (outer) cioi gnd gnd 2345 6 1 10 9 8 7 0.8 0.2 0.4 0.2 f 0.4 0.7 0.2 1.27 0.10 0.4 0.2 0.8 0.2 0.4 0.2 0.56 0.20 0.3 0.2 0.75 +0.20 3.1 0.2 cioi 6.4 0.2 + 0.1 0.2 ?.10 0.5 0.2 0.25 0.20 0.5 0.2 0.8 0.1 0.25 0.20 0.5 0.2 0.4 0.2 0.45 0.20 0.4 0.2 2.1 0.2 cioi 4.0 0.2 f 0.3 +0.1 ?.2 0.65 +0.20 ?.10 explanation of part number construction circuit con? guration size : 1608 inches mass (wei ght) [1000 pcs.] : 17 g size : 2512 inches mass (weight) [1000 pcs.] : 52 g dimensions in mm (not to scale) feb. 2006
chip 3-terminal capacitor array design an d speci cations are each subject to change without notice. ask factory for the current technical speci cations befo re purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. 1k 1k 2000 pf mn74hc04 mn74hc04 mn74hc04 8mhz eza sce470m measurement circuit measurement circuit 50 50 ezanc ~ 0 10 20 30 40 50 1m 10m 100m 1g 3g attenuation (db) 0 10 20 30 40 50 1m 10m 100m 1g 3g attenuation (db) frequency (hz) chip 3-terminal capacitor array ( ezanc) 47 0p f 220pf 100pf 47pf 22p f ratings (1) in measuring at 1 mhz, capacitance value and dissipation fac tor are different. (2) rated current between input terminal and output ter mi nal. (3) resistance value between input terminal and out put terminal. attenuation characteristics 100 80 60 40 20 100 80 60 40 20 100 200 400 600 800 1000 100 200 400 600 800 1000 f requency (mhz) electric ? eld intensity (db?) f requency (mhz) electric ? eld intensity (db?) ? equivalent to emi ? lter pa c kaging methods (taping) standard quantity item speci? cation ezasc ezanc capacitance values (25 ?, 1 khz (1) , 1 vrms) 10 pf to 180 pf standard : 22 pf, 47 pf, 100 pf 22 pf, 47 pf, 100 pf, 220 pf, 470 pf capacitance tolerance ?0% ( +30% in the case of less than 22 pf) t emperature characteristic e characteristic: +20 %/?5 % (?5 ? to +85 ?) dissipation factor less than 2 % (25 ?, 1 khz (1) , 1 vrms) rated voltage 25 v rated current (2) 200 ma 300 ma resistance (3) less than 1 category temperature range (operating temperature range) ?5 ? to +85 ? ?0% ty pe kind of taping pitch (p 1 ) quantity ezasc embossed carrier taping 4 mm 4000 pcs./reel ezanc feb. 2006
chip 3-terminal capacitor array design an d speci cations are each subject to change without notice. ask factory for the current technical speci cations befo re purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. t 1 t 2 chip component p 1 p 2 p 0 compartment sprocket hole f d 0 tape running direction e f w a b f d 1 f b w t f a f c gnd c f2 f1 a e d b p land pattern solder resistant embossed carrier taping t aping reel recommended land pattern design chip 3-terminal capacitor array (ezanc/ezasc) t ype a b w f e p 0 dimensions (mm) ezasc 2.50 ?.20 4.40 ?.20 12.00 ?.30 5.50 ?.20 1.75 ?.20 4.00 ?.10 ezanc 3.50 ?.20 6.80 ?.20 t ype p 1 p 2 f d 0 t 1 t 2 f d 1 dimensions (mm) ezasc 4.00 ?.10 2.00 ?.05 1.50 +0.10 0.25 ?.05 1.15 ?.20 1.50 +0.10 ezanc 1.30 ?.20 ?0 ?0 dimensions (mm) f a f b f c 180 +0 60 min. 13.0 ?.0 dimensions (mm) wt 13.0 ?.0 15.4 ?.0 ? 3.0 t ype a b c d e f1 f2 p dimensions (mm) ezasc 1.2 to 1.4 0.4 3.1 to 3.3 0.4 to 0.5 0.8 2.9 to 3.3 4.8 to 5.2 0.8 ezanc 2.2 to 2.4 0.4 to 0.6 5.7 to 5.9 0.4 to 0.8 1.8 4.2 to 4.6 7.5 to 7.9 1.27 feb. 2006
chip 3-terminal capacitor array design an d speci cations are each subject to change without notice. ask factory for the current technical speci cations befo re purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. preheating peak heating temperature time the following are precautions for individual prod ucts. please also refer to the precautions common to emi filters, fuses, and sensors(mr elements) shown on page ex2 of this catalog. 1. take measures against mechanical stress during and after mounting of chip 3-terminal capacitor array (hereafter called the capacitor arrays) so as not to damage their electrodes and pro tec tive coat ings. be careful not to misplace the capacitor arrays on the land patterns. otherwise, solder bridging may occur. 2. do not use halogen-based or other high-activity flux. otherwise, the residue may impair the capacitors arrays' per for mance and/or reliability. 3. when soldering with a soldering iron, never touch the capacitor arrays' bodies with the tip of the soldering iron. when using a soldering iron with a high temperature tip, ? nish soldering as quickly as possible (within three seconds at 350 c max.). 4. as the amount of applied solder becomes larger, the mechanical stress applied to the capacitor arrays increases, causing problems such as cracks and faulty characteristics. avoid applying an excessive amounts of solder. 5. do not apply shock to the capacitor arrays or pinch them with a hard tool (e.g. pliers and tweezers). otherwise, the capacitor arrays' protective coatings and bodies may be chipped, af fect ing their per for mance. 6. avoid excessive bending of printed circuit boards in order to protect the capacitor arrays from ab nor mal stress. 7. the static capacitance may decrease by a few percent from the time of shipment due to the char ac ter is tics peculiar to dielectric materials having a high dielectric constant. recommended soldering conditions for re? ow recommended soldering conditions recommendations and precautions are described below. flow soldering we do not recommend flow soldering to the chip 3-terminal capacitor array: ezasc, because solder bridging may occur due to the narrow 0.8 mm pitch of ezasc. please contact us regarding flow soldering of ezanc type. safety precautions ?e ow soldering shall be performed a maximum of two times. please contact us for additional information when used in conditions other than those speci? ed. please measure the temperature of the terminals and study every kind of solder and printed circuit board for solderability before actual use. for soldering (example : sn/pb) t emperature time preheating 140 ? to 160 ? 60 s to 120 s main heating above 200 ? 30 s to 40 s peak 235 ?5 ? max. 10 s t emperature time preheating 150 ? to 180 ? 60 s to 120 s main heating above 230 ? 30 s to 40 s peak max. 260 ? max. 10 s for lead-free soldering (example : sn/ag/cu) feb. 2006
? ex2 ? safety precautions (common precautions for emi filters, fuses, and sensors[mr elements]) when using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the speci? cations with us in advance. the design and speci? cations in this catalog are subject to change without prior notice. do not use the products beyond the speci? cations described in this catalog. this catalog explains the quality and performance of the products as individual components. before use, check and evaluate their operations when installed in your products. install the following systems for a failsafe design to ensure safety if these products are to be used in equip ment where a defect in these products may cause the loss of human life or other signi? cant dam age, such as damage to vehicles (automobile, train, vessel), traf? c lights, medical equipment, aerospace equipment, electric heating appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment. ? systems equipped with a protection circuit and a protection device ? systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a sin gle fault (1) precautions for use these products are designed and manufactured for general and standard use in general elec tron ic equipment (e.g. av equipment, home electric appliances, of? ce equipment, information and communication e quipment) these products are not intended for use in the following special conditions. before using the products, carefully check the effects on their quality and performance, and determine whether or not they can be used. 1. in liquid, such as water, oil, chemicals, or organic solvent 2. in direct sunlight, outdoors, or in dust 3. in salty air or air with a high concentration of corrosive gas, such as cl 2 , h 2 s, nh 3 , so 2 , or no 2 4. electric static discharge (esd) environment these components are sensitive to static electricity and can be damaged under static shock (esd). please take measures to avoid any of these environments. smaller componen ts are more sensitive to esd environment. 5. electromagnetic environment avoid any enviro nment wher e strong electromagnetic waves exist. 6. in an environment where these products cause dew condensation 7. sealing or coating of these products or a printed circuit board on which these products are mounted, with resin or other materials these products generate joule heat when energized. carefully position these products so that their heat will not affect the other components. carefully position these products so that their temperatures will not exceed the category temperature range due to the effects of neighboring heat-generating components. do not mount or place heat-generating components or in? ammables, such as vinyl-coated wires, near these products (except thermal cutoffs). note that non-cleaning solder, halogen-based highly active ? ux, or water-soluble ? ux may deteriorate the performance or reliability of the products. carefully select a ? ux cleaning agent for use after soldering. an unsuitable agent may deteriorate the performance or reliability. in particular, when using water or a water-soluble cleaning agent, be careful not to leave water residues. otherwise, the insulation performance may be deteriorated. (2) precautions for storage the performance of these products, including the solderability, is guaranteed for a year from the date of ar riv al at your company, provided that they remain packed as they were when delivered and stored at a tem per a ture of 5 c to 35 c and a relative humidity of 45 % to 85 %. (micro chip fuses: guaranteed for 6 months from the date of arrival at your company) the performance of emi filters is guaranteed for 6 months or a year from the out go ing inspection date indicated on the packages, provided that they are stored at a temperature of -5 c to +40 c and a relative humidity of 40 % to 60 %. check the guarantee period in the speci? cations. the performance of thermal cut offs is guaranteed for a year from the outgoing inspection date indicated on the packages, provided that they are stored at a temperature of -10 c to +40 c and a relative humidity of 30 % to 75 %. even within the above guarantee periods, do not store these products in the following conditions. otherwise, their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials) may be deformed or deteriorated, resulting in mounting failures. 1. in salty air or in air with a high concentration of corrosive gas, such as cl 2 , h 2 s, nh 3 , so 2 , or no 2 2. in direct sunlight package markings include the product number, quantity, and country of origin. in principle, the country of origin should be indicated in english. feb. 2006
mouser electronics authorized distributor click to view pricing, inventory, delivery & lifecycle information: panasonic: ? EZA-NCE221M? eza-nce471m
|
